NanoFEA

NanoFEA is an innovative startup that excels in the field of microelectronics packaging and assembly, ensuring component dependability. Our core strength is in utilizing model-driven analysis to enhance electronic assembly and the design and refinement of components. We possess specialized knowledge in identifying failure mechanisms, developing packaging materials with superior heat conduction, creating materials that capture outgassing, and devising effective strategies for boosting reliability. The typical causes of assembly malfunctions include breached hermetic seals, the release of gases from packaging substances, inadequate thermal management, mechanical stress, and wear and tear due to impact and oscillation. NanoFEA addresses these issues related to packaging dependability by employing high-k thermal materials, low-outgassing adhesives, and traced gas absorbing gettering materials. These efforts are bolstered by our use of AI-enhanced finite element analysis (FEA) and computational fluid dynamics modeling and simulation.

NanoFEA offers specialized engineering services:

Outgassing Analysis of microelectronics packages:

  • Identifying primary outgassing sources from packaging materials (polymers, epoxies, PCBs, sealants, and fibers etc.)

  • Designing outgas test from package materials to identify what the dominate emissions (N2, O2, CO2, H2, H2O, organics...) are.

  • Assessing hermetic vacuum or N2 filled seals in metal enclosures or glass ampules for customer package materials.

  • Subjecting packaging materials to elevated temperatures (≥150°C) for desired back out periods under vacuum.

  • Conducting Residual Gas Analysis (RGA) to analyze RGA data and evaluate package material outgassing severity.

  • Providing safety-factor-based reliability analysis and recommendations for getter selection (HRA, HRL, Cookson, SEAS etc.) and installation .

Finite Element Analysis of mechanical assembly and component:

  • Evaluating structural mechanical stress, interfacial stress, and assessing design safety factors.

  • Analyzing mechanical stress induced by elevated temperatures and/or pressures, as well as reliability assessment.

  • Conducting dynamic modal analysis, and assess responses to random vibrations and shocks.

  • Offering insights into failure modes, methods for reliability improvement, and design optimization strategies.

Novel packaging materials for package reliability improvement:

  • Si-Al (0.2-1.0 nm) molecular sieve based polymer composite nanomaterials for scavenging hydrogen, moisture and organics from package materials

  • Zr-MgAl and Zr-Mg metal/ceramic composite non-evaporable gettering nanomaterials for scavenging package material outgases (O2, N2, CO2, H2, H2O, HCs)

  • High thermal conductive materials (HRA Diamond-metal composite, graphite and graphene) for enhanced package heat dissipation and thermal management

  • Thermal conductive/electric insulation low-outgas epoxy and adhesive NASA quantified material for package component integration

  • Offering insights into how the novel nanomaterial can improve package reliability, and mission based application strategies.

Computational Fluid Dynamics Modeling for package thermal management

  • Analyzing 3D heat dissipation profile of package components and pinpointing areas of excessive temperature or hot spots

  • Evaluating the effectiveness of thermal management components such as heat sinks, spreaders, and thermal interface materials

  • Performing analyses of heat transfer through conduction, as well as natural and forced convection processes

  • Investigating how heat is dispersed from vital power electronics components under various heat transfer conditions

  • Providing expertise on thermal management within packaging and strategies for optimizing thermal materials.

Get in touch

NanoFEA, LLC © 2024
418 Broadway STE N, Albany NY 12207
Phone: (832)367-0197, Email: [email protected]
website: www.nanofea.com